Computational Fluid Dynamics Investigation of Flow Dynamics and Thermal Performance on Pin Fin Heat Exchanger
Keywords:
Heat Transfer, Pin Fin, Microchannel, Cooling System, Electronic Devices, OptimizationAbstract
The increasing demand for compact cooling systems for high-performance electronic devices has sparked interest in thermal enhancement techniques. While previous studies have individually explored microchannel and pin fin heat sinks, limited research has investigated their combined effects. This study investigates the synergistic impact of pin fin and microchannel heat sinks on fluid flow and heat transfer characteristics across various Reynolds numbers and heat flux conditions. Experimental and numerical analyses were conducted to compare different heat sink configurations, with experimental results demonstrating good agreement with theoretical correlations, albeit with slight deviations. Computational Fluid Dynamics (CFD) simulations were employed to analyze various heat sink configurations, revealing that square pin fin arrangements exhibited superior heat transfer performance.
Additionally, the influence of the porous medium on heat sink performance was examined, showing significant impacts on heat transfer. Moreover, microchannel pin-fin heat sinks demonstrated superior performance to conventional pin-fin heat sinks, indicating potential for further enhancement in microchannel pin-fin heat exchangers. Optimization studies utilizing entropy generation minimization techniques highlighted opportunities for enhancing overall heat sink performance. These findings offer valuable insights for designing efficient cooling systems for electronic devices.